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DEM

产品特征

更小的尺寸在PC板波峰焊接过程中提供更好的散热对流;
顶部胶带密封,可承受波峰焊接和板面清洗;
所有塑料均为UL 94V-0级防火材料;
金镀接触点确保低接触电阻和较长的机械寿命。


Smaller size makes better heat convection during PC board wave soldering;
Top tape sealed to withstand wave soldering,board washing;
All plastics are UL 94V-0 grade fire retardant;
Gold plated contact to ensure low contact resistance and long mechanical life.

产品应用

手持电子设备,如PDA、MP3、收音机;
便携式计算机和电子设备,如笔记本电脑、计算机;
仪器仪表和工业控制产品,如CD-ROM、投币机。


Hand-held electronic devices, such as PDA,MP3,radios;
Portable computer and electronic devices,such as notebook,computers;
Instrumentation and industrial control products,such as CDROM, coin changers

订货信息

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技术参数

项目 Items参数 Standard
环境性能 Environmental工作温度范围 Operating temperature range-20℃ to +85℃
存储温度范围 Storage Temperature Range-40℃ to +85℃
电气性能 Electrical performance电气寿命 Electrical Life2,000  cycles
切换额定值 Switching Rating25mA, 24VDC
机械性能 Mechanical performance操作力 Operating force1,000gf
行程 Travel1.0mm
包装 Package管装 TubeDEM(R)-01:194pcs/tube
DEM(R)-02:95pcs/tube
DEM(R)-03:63pcs/tube
DEM(R)-04:47pcs/tube
DEM(R)-05:38pcs/tube
DEM(R)-06:31pcs/tube
DEM(R)-07:27pcs/tube
DEM(R)-08:23pcs/tube
DEM(R)-09:21pcs/tube
DEM(R)-10:19pcs/tube
DEM(R)-12:15pcs/tube
编带与卷盘 Tape and ReelDEM(R) series:900pcs/reel

规格图

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电路图

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